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现行 BS 6221-6:1982
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Printed wiring boards-Specification for multilayer printed wiring boards 印刷线路板 多层印制线路板规范
发布日期: 1982-01-29
关于待评估特性的基本信息,以及电路板的要求,无论其制造方法如何,包括复合测试模式。交叉引用:BS 2011BS 4584BS 5830BS 6221:第2BS 6221部分:第3BS 6221部分:第4BS 6221部分:第5IEC 194IEC 326-1IEC 326-7IEC 326-8IEC文件52(中央办公室)248
Fundamental information on characteristics to be assessed and requirements for the boards irrespective of their method of manufacture and includes a composite test pattern.Cross References:BS 2011BS 4584BS 5830BS 6221:Part 2BS 6221:Part 3BS 6221:Part 4BS 6221:Part 5IEC 194IEC 326-1IEC 326-7IEC 326-8IEC Document 52(Central Office)248
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发布单位或类别: 英国-英国标准学会
关联关系
研制信息
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现行
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现行
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