现行

GB/T 7092-2021

半导体集成电路外形尺寸
Outline dimensions of semiconductor integrated circuits

2021-03-09

现行

GB/T 15878-2015

半导体集成电路 小外形封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for small outline package

2015-05-15

现行

GB/T 15138-1994

膜集成电路和混合集成电路外形尺寸
Case outlines for film integrated circuits and hybrid integrated circuits

1994-06-25

现行

BS EN 60191-3-2000

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化 集成电路外形图绘制通则

2000-06-15

现行

GB/T 7581-1987

半导体分立器件外形尺寸
Dimensions of outlines for semiconductor discrete devices

1987-03-27

现行

BS IEC 60748-5-1997

Semiconductor devices. Integrated circuits-Semicustom integrated circuits
半导体器件 集成电路 半定制集成电路

1997-08-15

现行

BS IEC 60748-2-1997

Semiconductor devices. Integrated circuits-Digital integrated circuits
半导体器件 集成电路 数字集成电路

1998-04-15

现行

BS IEC 60748-11-2000

Semiconductor devices. Integrated circuits-Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 集成电路 不包括混合电路的半导体集成电路分规范

2011-07-31

现行

IEC 60191-3-1999

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化.第3部分:集成电路外形图编制的一般规则

1999-10-29

现行

SJ/Z 9021.3-1987

半导体器件的机械标准化 第３部分：集成电路外形图绘制总则
Mechanical standardization of semiconductor devices--Part 3: General rules for the preparation of outline drawings of integrated circuits

1987-09-14

现行

UNE-EN 60191-3-2001

Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
半导体器件机械标准化第3部分:集成电路外形图绘制通则

2001-01-31

现行

BS 6493-2.3-1987

Semiconductor devices. Integrated circuits-Recommendations for analogue integrated circuits
半导体器件 集成电路 模拟集成电路的推荐标准

1987-01-30

现行

KS C IEC 60050-521(2017 Confirm)

반도체 소자 - 집적회로 용어
半导体器件和集成电路

2002-03-29

现行

KS C IEC 60050-521(2022 Confirm)

반도체 소자 - 집적회로 용어
半导体器件和集成电路

2002-03-29

现行

IEC 60748-11-1990

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 - 集成电路 - 第11部分:不包括混合电路的半导体集成电路的分段规范

1990-12-20

现行

KS C IEC 60748-11

반도체 소자 — 집적 회로 — 제11부:반도체 집적 회로에 대한 품종 규격(혼성 회로 제외)
半导体器件 - 集成电路 - 第11部分:不包括混合电路的半导体集成电路的分段规范

2020-07-23

现行

GB/T 12750-2006

半导体器件 集成电路 第11部分：半导体集成电路分规范（不包括混合电路）
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

2006-08-23

现行

KS C IEC 60748-3(2017 Confirm)

반도체 소자－집적 회로 제3부：아날로그 집적 회로
半导体器件集成电路第3部分:模拟集成电路

2002-11-30

现行

IEC 60748-2-1997

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
半导体器件 - 集成电路 - 第2部分:数字集成电路

1997-12-22

现行

IEC 60748-5-1997

Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
半导体器件 - 集成电路 - 第5部分:半定制集成电路

1997-05-30