IEC 60749-39:2021 RLV包含官方IEC国际标准及其红线版本。Redline版本仅提供英文版本，为您提供了一种快速简单的方法来比较IEC官方标准与其以前版本之间的所有变化。 IEC 60749-39:2021详细说明了测量半导体元件封装中使用的有机材料中水分扩散率和水溶性的特征性质的程序。这两种材料特性是塑料封装半导体在暴露于湿气和经受高温焊料回流后的有效可靠性性能的重要参数。与上一版相比，此版本包括以下重大技术变更: -更新了“干重”测定程序。

IEC 60749-39:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition:
- updated procedure for "dry weight" determination.