IEC 60749-21:20 11建立了用于确定器件封装端子的可焊性的标准程序，该器件封装端子旨在使用锡铅（SnPb）或无铅（Pb）焊料进行连接到另一个表面。本测试方法提供了通孔、轴向和表面安装器件（SMD）的“浸渍和外观”可焊性测试程序，以及SMD的电路板安装可焊性测试程序，目的是允许模拟器件应用中使用的焊接过程。该测试方法还提供了可选的老化条件。除非相关规范中另有详细说明，否则该试验被视为破坏性试验。 注1该测试方法一般符合IEC 60068，但由于半导体的特殊要求，适用以下文本。注2本试验方法不评估焊接过程中可能出现的热应力的影响。应参考IEC 60749-15或IEC 60749-20。 本标准取消和取代2004年发布的第一版，构成技术性修订。显著的变化是包含了无铅向后兼容性。

IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.
This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.