IEC 60191-4:20 13+A1:2018规定了用于半导体器件的封装轮廓的指定和用于封装轮廓的形式的分类的方法，以及用于生成用于半导体器件封装的通用描述性指示符的系统方法。描述性指示符提供了有用的通信工具，但没有用于确保封装互换性的隐含控制。与上一版相比，此版本包括以下重大技术变更: a)添加材料代码“S”以指示硅基封装。 b)添加“WL”的描述以用于一般用途。该合并版本由第三版（2013年）及其修正案1（2018年）组成。因此，除本出版物外，无需下令修订。

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.