现行

SJ/Z 9021.4-1987

半导体器件的机械标准化 第４部分：半导体器件封装外形图类型的划分以及编号体系
Mechanical standardization of semiconductor devices--Part 4: Coding system and classification into forms of package outlines for semiconductor devices

1987-09-14

现行

IEC 60191-4-2013+AMD1-2018 CSV

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

现行

IEC 60191-4-2013

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化 - 第4部分:编码系统和分类为半导体器件封装的封装轮廓形式

2013-10-10

现行

GB/T 15879.4-2019

半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2019-08-30

现行

IEC 60191-4-2013/AMD1-2018

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

现行

IEC 60191-2-1966/AMD4-2001

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件4.半导体器件的机械标准化.第2部分:尺寸

2001-11-27

现行

BS EN 60191-4-2014+A1-2018

Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化

2018-05-30

现行

SJ/Z 9021.1-1987

半导体器件的机械标准化 第１部分：半导体器件图形绘制
Mechanical standardization of semiconductor devices--Part 1: Preparation of drawings of semiconductor devices

1987-09-14

现行

DIN IEC 60191-4-DRAFT

Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
文件草稿.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类形式（IEC 47D/769/CD:2010）

2010-07-01

现行

IEC 60191-2X-1999

Mechanical standardization of semiconductor devices - Part 2: Dimensions
半导体器件的机械标准化.第2部分:尺寸

1999-09-30

现行

IEC 60191-2-1966

Mechanical standardization of semiconductor devices. Part 2: Dimensions
半导体器件的机械标准化 第2部分:尺寸

1966-01-01

现行

SJ/Z 9021.2-1987

半导体器件的机械标准化 第２部分：尺寸
Mechanical standardization of semiconductor devices--Part 2:Dimensions

1987-09-14

现行

IEC 60191-2-1966/AMD1-2001

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件1.半导体器件的机械标准化.第2部分:尺寸

2001-03-15

现行

IEC 60191-2-1966/AMD8-2003

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件8——半导体器件的机械标准化 第2部分:尺寸

2003-06-27

现行

IEC 60191-2-1966/AMD12-2006

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件12.半导体器件的机械标准化.第2部分:尺寸

2006-03-24

现行

IEC 60191-2-1966/AMD10-2004

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件10.半导体器件的机械标准化.第2部分:尺寸

2004-03-29

现行

IEC 60191-2-1966/AMD14-2006

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件14.半导体器件的机械标准化.第2部分:尺寸

2006-07-17

现行

IEC 60191-2-1966/AMD20-2018

Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件20.半导体器件的机械标准化.第2部分:尺寸

2018-04-12

现行

IEC 60191-2-1966/AMD5-2002

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件5——半导体器件的机械标准化 第2部分:尺寸

2002-02-12

现行

IEC 60191-2-1966/AMD15-2006

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件15.半导体器件的机械标准化.第2部分:尺寸

2006-07-17