现行

BS IEC 60191-2-1966+A21-2020

Mechanical standardization of semiconductor devices-Dimensions
半导体器件的机械标准化

2020-04-02

现行

SJ/Z 9021.1-1987

半导体器件的机械标准化 第１部分：半导体器件图形绘制
Mechanical standardization of semiconductor devices--Part 1: Preparation of drawings of semiconductor devices

1987-09-14

现行

IEC 60191-2X-1999

Mechanical standardization of semiconductor devices - Part 2: Dimensions
半导体器件的机械标准化.第2部分:尺寸

1999-09-30

现行

SJ/Z 9021.2-1987

半导体器件的机械标准化 第２部分：尺寸
Mechanical standardization of semiconductor devices--Part 2:Dimensions

1987-09-14

现行

IEC 60191-2-1966

Mechanical standardization of semiconductor devices. Part 2: Dimensions
半导体器件的机械标准化 第2部分:尺寸

1966-01-01

现行

BS EN 60191-4-2014+A1-2018

Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化

2018-05-30

现行

DIN IEC 60747-15-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
文件草案.半导体器件.分立器件.第15部分:隔离功率半导体器件（IEC 47E/322/CD:2007）

2007-06-01

现行

DIN EN 60191-6-16-DRAFT

Draft Document - Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
文件草案.半导体器件的机械标准化.第6-16部分:BGA LGA FBGA和FLGA用半导体试验和老化插座术语表（IEC 47D/835/CD:2013）

2013-08-01

现行

SJ/Z 9021.4-1987

半导体器件的机械标准化 第４部分：半导体器件封装外形图类型的划分以及编号体系
Mechanical standardization of semiconductor devices--Part 4: Coding system and classification into forms of package outlines for semiconductor devices

1987-09-14

现行

UNE-EN 60191-4-2001

Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
半导体器件机械标准化第4部分:半导体器件封装外形的编码系统和分类

2001-01-23

现行

IEC 60191-4-2013+AMD1-2018 CSV

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

现行

IEC 60191-4-2013

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化 - 第4部分:编码系统和分类为半导体器件封装的封装轮廓形式

2013-10-10

现行

GB/T 15879.4-2019

半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2019-08-30

现行

IEC 60191-2-1966/AMD16-2007

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件16.半导体器件的机械标准化.第2部分:尺寸

2007-07-25

现行

IEC 60191-2-1966/AMD3-2001

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件3.半导体器件的机械标准化.第2部分:尺寸

2001-08-28

现行

IEC 60191-2-1966/AMD17-2008

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件17.半导体器件的机械标准化.第2部分:尺寸

2008-05-27

现行

IEC 60191-2-1966/AMD2-2001

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件2.半导体器件的机械标准化.第2部分:尺寸

2001-06-20

现行

IEC 60191-2-1966/AMD5-2002

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件5——半导体器件的机械标准化 第2部分:尺寸

2002-02-12

现行

IEC 60191-2-1966/AMD15-2006

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件15.半导体器件的机械标准化.第2部分:尺寸

2006-07-17

现行

IEC 60191-2-1966/AMD11-2004

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件11.半导体器件的机械标准化.第2部分:尺寸

2004-11-23