IEC 61188的本部分规定了电路板焊接表面的要求。这包括表面安装组件的焊环和焊环图案，以及通孔安装组件的可焊孔配置。这些要求基于IEC 61191-1、IEC 61191-2、IEC 61191-3和IEC 61191-4的焊点要求。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.All current amendments available at time of purchase are included with the purchase of this document.