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现行 IEC 63275-1:2022
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Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability 半导体器件碳化硅分立金属氧化物半导体场效应晶体管可靠性试验方法第1部分:偏置温度不稳定性试验方法
发布日期: 2022-04-21
IEC 63275-1:2022给出了一种在高温下施加连续正栅极源电压应力后,使用室温读数评估碳化硅功率金属氧化物半导体场效应晶体管(MOSFET)栅极阈值电压漂移的测试方法。该方法允许应力和测量之间存在较大的延迟时间(长达10小时),从而可以接受一定量的恢复。
IEC 63275-1:2022 gives a test method to evaluate gate threshold voltage shift of silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) using room temperature readout after applying continuous positive gate-source voltage stress at elevated temperature. The proposed method accepts a certain amount of recovery by allowing large delay times between stress and measurement (up to 10 h).
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归口单位: TC 47
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