IEC 60749-15:20 20作为IEC 60749-15:20 20 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60749-15:20 20描述了一项测试用于确定用于通孔安装的封装固态器件是否能够承受使用波峰焊焊接其引线期间所承受的温度影响。为了建立最可重复性方法的标准测试程序，采用了浸焊法，因为它的条件更可控。该程序确定器件是否能够承受印刷线路板组装操作中遇到的焊接温度，而不会降低其电气特性或内部连接。该测试具有破坏性，可用于确认、批次验收和产品监测器。热量从电路板背面的焊料热量通过引线传导到器件封装中。此程序不模拟与封装体同一侧电路板上的波峰焊或回流热暴露。与上一版相比，此版本包括以下重大技术变更: -加入新订的第3条，术语和定义； -阐明烙铁用于产生加热效果的用途； -纳入使用加速老化的选项。

IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.