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现行 BS IEC 60747-14-11:2021
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Semiconductor devices-Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature 半导体器件
发布日期: 2021-03-12
IEC 60747的本部分定义了可以使用的术语、定义、配置和测试方法 用于评估和确定声表面波的性能特征 集成了紫外线、照度和温度传感器的半导体传感器。 测量方法包括直流特性和射频特性,以及 射频特性的测量方法包括直接模式和差分放大器 基于反馈振荡的模式。本文件不包括TC 49处理的设备: 用于频率控制的压电、介电和静电装置及相关材料, 选择和检测。购买本文件时可获得的所有当前修订均包含在购买本文件中。
This part of IEC 60747 defines the terms, definitions, configuration, and test methods can be used to evaluate and determine the performance characteristics of surface acoustic wavebased semiconductor sensors integrated with ultraviolet, illuminance, and temperature sensors. The measurement methods are for DC characteristics and RF characteristics, and the measurement method for RF characteristics includes a direct mode and differential amplifier mode based on feedback oscillation. This document excludes devices dealt with by TC 49: piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection.All current amendments available at time of purchase are included with the purchase of this document.
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发布单位或类别: 英国-英国标准学会
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现行
IEC 60747-14-11-2021
Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
半导体器件.第14-11部分:半导体传感器.测量紫外线、照明和温度的基于表面声波的集成传感器的试验方法
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IEC 60747-18-1-2019
Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
半导体器件第18-1部分:半导体生物传感器无透镜CMOS光子阵列传感器校准的试验方法和数据分析
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IEC 62047-37-2020
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半导体器件微机电器件第37部分:传感器用MEMS压电薄膜的环境试验方法
2020-04-28
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BS EN IEC 60749-30-2020
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2020-09-30
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IEC 60749-30-2020 RLV
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半导体器件.机械和气候试验方法.第30部分:可靠性试验前非密封表面安装器件的预处理
2020-08-17
现行
IEC 60749-30-2020
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 - 机械和气候测试方法 - 第30部分:在可靠性测试之前对非密封性表面贴装器件进行预处理
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现行
UNE-EN 60749-30-2005
Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件机械和气候试验方法第30部分:可靠性试验前非密封表面安装器件的预处理
2005-11-02
现行
GB/T 4937.30-2018
半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
2018-09-17
现行
IEC 60747-5-14-2022
Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method
半导体器件第5-14部分:光电子器件发光二极管基于热反射法的表面温度试验方法
2022-03-04
现行
BS EN 60749-20-1-2009
Semiconductor devices. Mechanical and climatic test methods-Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件 机械和气候试验方法
2009-07-31
现行
IEC 60749-20-1-2019 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件.机械和气候试验方法.第20-1部分:对湿气和焊接热的综合影响敏感的表面安装器件的搬运 包装 标签和装运
2019-06-26
现行
IEC 60749-20-1-2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件 - 机械和气候测试方法 - 第20-1部分:表面贴装装置的处理 包装 标签和运输对水分和焊接热的综合影响敏感
2019-06-26
现行
GB/T 4937.201-2018
半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
2018-09-17
现行
DIN EN IEC 60749-20-1-DRAFT
Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
文件草案——半导体器件——机械和气候试验方法——第20-1部分:对湿气和焊接热的综合影响敏感的表面安装器件的搬运、包装、标签和装运(IEC 47/2488/CDV:2018);德文版和英文版prEN IEC 60749-20-1:2018
2018-11-01