MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)-焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔-国家数字标准馆

现行 MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)

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Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting 焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

发布日期： 2013-06-21

本规范涵盖了带有镀孔的刚性多层（三层或三层以上导体层）印制线路板（以下简称印制板）的一般性能要求，这些印制线路板将使用焊接进行部件/零件安装（见6.1.1）。

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).

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发布单位或类别：美国-美国军事规范和标准

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相似标准/计划/法规

MIL MIL-PRF-31032/5C

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
印刷线路板刚性、多层、热塑性、热固性或热塑性和热固性树脂基材带电镀通孔用于高频应用

MIL MIL-PRF-31032/5 Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
用于高频应用的带有镀通孔的刚性、多层、热塑性、热固性或热塑性和热固性树脂基材印刷线路板

MIL MIL-PRF-31032/5 Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
用于高频应用的带有镀通孔的刚性、多层、热塑性、热固性或热塑性和热固性树脂基材印刷线路板

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷线路板刚性多层热固性树脂基材带或不带盲板和埋入式电镀通孔用于焊接部件安装

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
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MIL MIL-PRF-31032/1D Amendment 2

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

MIL MIL-PRF-31032/1B Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印制线路板带或不带盲板和埋板通孔

MIL MIL-PRF-31032/1D Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

MIL MIL-PRF-31032/1D Amendment 1

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板带或不带盲板和埋板通孔

MIL MIL-PRF-31032/1B Amendment 1

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1A)
印刷线路板多层热固化树脂基材具有或不带有盲孔和被覆盖的套管用于焊接部分安装（取代MIL-PRF-31032/1A）

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板刚性单层和双层热固性树脂基材带或不带电镀通孔用于焊接部件安装

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板刚性单层和双层热固性树脂基材带或不带电镀孔用于焊接部件安装

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
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MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

MIL MIL-PRF-31032/2A Amendment 2

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
焊接部件安装用刚性单层和双层热固性树脂基材印刷线路板带或不带电镀通孔（代替MIL-PRF-31032/2）

MIL MIL-PRF-31032/2A Amendment 1

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
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MIL MIL-PRF-31032/6C

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
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MIL MIL-PRF-31032/6 Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
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