现行

MIL MIL-PRF-31032/5C

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
印刷线路板 刚性、多层、热塑性、热固性或热塑性和热固性树脂基材 带电镀通孔 用于高频应用

2020-05-05

现行

MIL MIL-PRF-31032/5 Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
用于高频应用的带有镀通孔的刚性、多层、热塑性、热固性或热塑性和热固性树脂基材印刷线路板

2011-01-31

现行

MIL MIL-PRF-31032/5 Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
用于高频应用的带有镀通孔的刚性、多层、热塑性、热固性或热塑性和热固性树脂基材印刷线路板

2009-03-10

现行

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷线路板 刚性多层热固性树脂基材 带或不带盲板和埋入式电镀通孔 用于焊接部件安装

2017-06-01

现行

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷电路板 刚性 多层 热固性树脂基材 带或不带盲孔和埋地电镀通孔 用于焊接部件安装

2012-11-01

现行

MIL MIL-PRF-31032/1D Amendment 2

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2018-07-11

现行

MIL MIL-PRF-31032/1B Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印制线路板 带或不带盲板和埋板通孔

2008-04-15

现行

MIL MIL-PRF-31032/1D Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2020-03-01

现行

MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2009-07-04

现行

MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2013-06-21

现行

MIL MIL-PRF-31032/1B Amendment 1

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/1A)
印刷线路板 多层 热固化树脂基材 具有或不带有盲孔和被覆盖的套管 用于焊接部分安装（取代MIL-PRF-31032/1A）

2006-02-24

现行

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板 刚性 单层和双层 热固性树脂基材 带或不带电镀通孔 用于焊接部件安装

2020-03-02

现行

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带电镀孔 用于焊接部件安装

2009-07-04

现行

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2018-06-12

现行

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基材刚性单层和双层印刷线路板

2008-04-23

现行

MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2012-11-02

现行

MIL MIL-PRF-31032/2A Amendment 2

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
焊接部件安装用刚性单层和双层热固性树脂基材印刷线路板 带或不带电镀通孔（代替MIL-PRF-31032/2）

2006-10-31

现行

MIL MIL-PRF-31032/2A Amendment 1

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带孔 用于焊接部分安装（取代MIL-PRF-31032/2）

2006-02-24

现行

MIL MIL-PRF-31032/6C

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
印刷线路板 刚性 单面和双面 热塑性树脂基材 带或不带电镀通孔 用于高频应用

2020-05-06

现行

MIL MIL-PRF-31032/6 Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
高频应用用带或不带镀通孔的热塑性树脂基刚性单面和双面印刷线路板

2009-04-10