IEC 60068-2-58:2015+A1:2017概述了适用于表面贴装器件（SMD）的测试Td。本标准提供了在使用焊料合金（共晶或近共晶锡铅（Pb）或无铅合金）的应用中测定器件的可焊性和耐焊接热性的程序。这些程序使用焊料浴或回流方法，并且仅适用于设计为能够承受短期浸泡在熔融焊料中或有限暴露于回流系统的样品或产品。当焊料槽（浸渍）方法合适时，焊料槽方法适用于设计用于流动焊接的SMD和设计用于回流焊接的SMD。回流方法适用于设计用于回流焊接的SMD，以确定SMD是否适合回流焊接以及焊料槽（浸渍）方法何时不合适。与上一版相比，此版本包括以下重大技术变更: -添加Sn-Bi低温焊料合金； -在表7中增加了几种回流测试条件-耐焊接热-测试条件和严重性，回流方法； -介绍用于测试Td3的回流测试方法:金属化的去湿和抗溶解性； -实施条款B.3中测试严重性选择指南。 该合并版本由第四版（2015年）及其修正案1（2017年）组成。因此，除本出版物外，无需下令修订。

IEC 60068-2-58:2015+A1:2017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition:
- the addition of Sn-Bi low temperature solder alloy;
- the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
- introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
- implementation of guidance for the choice of a test severity in Clause B.3.
This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.