介绍半导体器件的低气压测试。该试验主要用于确定零部件和材料避免因空气和其他绝缘材料的介电强度降低而导致电压击穿故障的能力。在降低的压力下，该试验仅适用于工作电压超过1000 V的设备。 本试验适用于所有半导体器件，前提是它们是腔型封装。该测试仅用于军事和空间相关应用。 2003年8月勘误表的内容已包含在本副本中。

Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.