硅基MEMS制造技术 基于SOI硅片的MEMS工艺规范
Silicon-based MEMS fabrication technology—Specification for criterion of the SOI wafer based MEMS process

2016-08-29

硅基MEMS制造技术 以深刻蚀与键合为核心的工艺集成规范
Silicon-based MEMS fabrication technology—Specification for criterion of the combination of the deep etching and bonding process

2016-08-29

硅基MEMS制造技术 体硅溶片工艺规范
Silicon-based MEMS fabrication technology - Specification for the dissolved wafer process

2012-05-11

硅基MEMS制造技术 氢氧化钾腐蚀工艺规范
Silicon-based MEMS fabrication technology - Specification for KOH etch process

2012-05-11

硅基MEMS制造技术 版图设计基本规则
Silicon-based MEMS fabrication technology - The basic regulation of layout design

2012-05-11

硅基MEMS制造技术 微键合区剪切和拉压强度检测方法
Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area

2012-05-11

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
半导体器件.微机电器件.第47部分:硅基MEMS制造技术.微结构弯曲强度的测量方法

2024-08-23

Semiconductor devices. Micro-electromechanical devices-Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 微机电设备

2016-11-30

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 - 微机电器件 - 第25部分:硅基存储器制造技术 - 微接合区域的拉压和剪切强度测量方法

2016-08-29

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
半导体器件.微机电器件.第25部分:硅基MEMS制造技术.微键合区域拉压和剪切强度的测量方法（IEC 62047-25-2016）；德文版EN 62047-25:2016

2017-04-01