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现行 IEC 62899-301-2:2017
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Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension 印刷电子 - 第301-2部分:设备 - 接触印刷 - 刚性主板 - 印版主尺寸的测量方法
发布日期: 2017-08-30
IEC 62899-301-2:20 17(E)定义了与特征的临界尺寸和特征在刚性板母版上的配准精度相关的测量术语和方法。 定义一般临界尺寸以评估板母版上特征的形状精度。为了评估板母版上的特征的配准精度,规定了板母版的配准标记的规格。然后,为器件制造商、印刷母版制造商和印刷母版制造设备供应商建立测量印版母版的临界尺寸和配准精度的通用计量程序。通过用户和供应商之间的协议测量的测量条款使用本文件中给出的测量方法进行测量。
IEC 62899-301-2:2017(E) defines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate masters.
General critical dimensions are defined to evaluate the shape accuracy of features on the plate master. To evaluate the registration accuracy of features on the plate master, the specification for the registration mark for the plate master is specified. Then, common metrology procedures to measure the critical dimensions and the registration accuracy of the plate master are established for device manufacturers, printing master manufacturers and printing master manufacturing equipment vendors. The measurement terms which are measured by agreement between the user and the supplier are measured using the measurement methods given in this document.
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归口单位: TC 119
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