Printed electronics-Equipment. Contact printing. Rigid master. Measurement method of plate master external dimension
印刷电子产品

2017-08-16

Printed electronics-Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
印刷电子产品

2017-11-16

Printed Electronics - Part 301-3: Equipment - Contact printing - Rigid master - Method to measure the shape errors of printing plate rollers
印刷电子产品.第301-3部分:设备.接触式印刷.刚性母版.印版辊形状误差的测量方法

2024-09-27

Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
印刷电子.第301-1部分:设备.接触印刷.刚性版材.版材外形尺寸的测量方法

2017-05-10

Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
印刷电子 - 第301-2部分:设备 - 接触印刷 - 刚性主板 - 印版主尺寸的测量方法

2017-08-30

인쇄전자 — 제301-1부: 장비 — 접촉식 인쇄 — 경질 인쇄판 — 평면 인쇄판의 외곽 형상 측정 방법
印刷电子.第301-1部分:设备.接触印刷.硬版.版型外部尺寸的测量方法

2021-06-14

인쇄전자 — 제301-2부: 장비 — 접촉식 인쇄 — 경질 인쇄판 — 평면 인쇄판의 패턴 치수 측정 방법
印刷电子.第301-2部分:设备.接触印刷.硬版.版母图案尺寸的测量方法

2021-06-14

Draft Document - Printed electronics - Materials - Part 1: Substrates (IEC 119/48/CD:2014)
文件草稿印刷电子材料第1部分:基板（IEC 119/48/CD:2014）

2014-11-01

Draft Document - Onsertion of printed circuit boards; determination of placement accuracy and performance of SMD onsertion equipment
文件草案——印刷电路板的认证；SMD安装设备放置精度和性能的测定

1991-09-01

MAINTENANCE PRINTS FOR ELECTRONIC EQUIPMENT, INSTRUCTIONS FOR PREPARATION OF (SUPERSEDING MIL-M-19562) (NO S/S DOCUMENT)
电子设备的维护打印件 准备说明（代替MIL-M-19562）（无S/S文件）

1995-07-20

MAINTENANCE PRINTS FOR ELECTRONIC EQUIPMENT, INSTRUCTIONS FOR PREPARATION OF (SUPERSEDING MIL-M-19562) (NO S/S DOCUMENT)
电子设备的维护打印件、准备说明（代替MIL-M-19562）（无S/S文件）

1966-06-29

Draft Document - Printed electronics - Materials - Part 2-1: Conductive Material Ink (IEC 119/49A/CD:2014)
文件草稿印刷电子材料第2-1部分:导电材料油墨（IEC 119/49A/CD:2014）

2014-11-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014)
文件草稿-电气材料、印制板和其他互连结构和组件的试验方法-第3-913部分:高亮度LED用电子电路板导热性的试验方法（IEC 91/1186/CD:2014）

2014-09-01

Draft Document - Connectors for electronic equipment - Tests and measurements - Part 9-4: Endurance tests - Test 9d: Durability of contact retention system and seals (maintenance, ageing) (IEC 48B/1857/CD:2008)
文件草案.电子设备连接器.试验和测量.第9-4部分:耐久性试验.试验9d:接触保持系统和密封件的耐久性（维护 老化）（IEC 48B/1857/CD:2008）

2008-05-01

Draft Document - Connectors for electronic equipment - Product requirements - Part 2-107: Detail specification for circular hybrid connectors M12 with electrical and fibre-optic contacts with screw locking (IEC 48B/1936/CD:2008)
文件草稿.文件草稿.电子设备连接器.产品要求.第2-107部分:带螺纹锁紧的电气和光纤触点的圆形混合连接器M12的详细规范（IEC 48B/1936/CD:2008）

2009-03-01

Draft Document - Connectors for electrical and electronic equipment - Product requirements - Part 2-116: Detail specification for circular connectors size 15 with up to 3+PE power contacts and auxiliary contacts, with bayonet-locking (IEC 48B/2872/CD:2021); Text in German and English
文件草案.电气和电子设备用连接器.产品要求.第2-116部分:尺寸为15的圆形连接器的详细规范 带3+PE电源触点和辅助触点 带卡扣锁（IEC 48B/2872/CD:2021）；德语和英语文本

2022-04-01