Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension
印刷电子.第301-1部分:设备.接触印刷.刚性版材.版材外形尺寸的测量方法

2017-05-10

Printed Electronics - Part 301-3: Equipment - Contact printing - Rigid master - Method to measure the shape errors of printing plate rollers
印刷电子产品.第301-3部分:设备.接触式印刷.刚性母版.印版辊形状误差的测量方法

2024-09-27

Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
印刷电子 - 第301-2部分:设备 - 接触印刷 - 刚性主板 - 印版主尺寸的测量方法

2017-08-30

인쇄전자 — 제301-2부: 장비 — 접촉식 인쇄 — 경질 인쇄판 — 평면 인쇄판의 패턴 치수 측정 방법
印刷电子.第301-2部分:设备.接触印刷.硬版.版母图案尺寸的测量方法

2021-06-14

Printed electronics-Equipment. Contact printing. Rigid master. Measurement method of plate master external dimension
印刷电子产品

2017-08-16

Printed electronics-Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
印刷电子产品

2017-11-16

Printed electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions
印刷电子 - 第303-1部分:设备 - 卷对卷印刷 - 机械尺寸

2018-05-07

인쇄전자 — 제303-1부: 장비 — 롤투롤 인쇄 — 기계적 치수
印刷电子产品第303-1部分:设备卷对卷印刷机械尺寸

2023-11-17

Draft Document - Printed electronics - Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension (IEC 119/62/CD:2014)
文件草稿-印刷电子设备-接触印刷-刚性版纸-版纸外部尺寸的测量方法（IEC 119/62/CD:2014）

2015-04-01

Printed electronics - Part 302-1: Equipment - Inkjet - Imaging based measurement of jetting speed
印刷电子 - 第302-1部分:设备 - 喷墨 - 基于成像的喷射速度测量

2017-08-10

인쇄전자 — 제302-1부: 장비 — 잉크젯 —이미징 기반의 토출 속도 측정
印刷电子.第302-1部分:设备.喷墨.基于成像的喷射速度测量

2021-06-14

Printed electronics - Part 304-1: Equipment - Sintering - Temperature measurement method for photonic sintering system
印刷电子器件.第304-1部分:设备.烧结.光子烧结系统的温度测量方法

2023-12-06

Connectors for electronic equipment. Printed board connectors with assessed quality-Detail specification for two-part power connector modules, for printed boards and backplanes having early mating features, and having a basic grid of 2,5 mm in accordance with IEC 60917-1
电子设备用连接器 经过质量评估的印制板连接器

2002-08-16

Amendment 1 - Connectors for electronic equipment - Product requirements - Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function
修改件1.电子设备连接器.产品要求.第4-116部分:印制板连接器.带集成屏蔽功能的高速两件式连接器详细规范

2015-11-23

Connectors for electronic equipment -- Part 4-111: Printed board connectors with assessed quality - Detail specification for two-part power connector modules, for printed boards and backplanes having early mating features, and having a basic grid of 2,5 mm in accordance with IEC 60917-1
电子设备用连接器第4-111部分:经质量评定的印制板连接器IEC 60917-1规定的2.5mm基本网格的印制板和背板用两部分电源连接器模块详细规范

2003-06-20

Connectors for electronic equipment. Printed board connectors with assessed quality-Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm
电子设备用连接器 经过质量评估的印制板连接器

2003-06-23

Connectors for electronic equipment - Part 4-111: Printed board connectors with assessed quality; Detail specification for two-part power connector modules, for printed boards and backplanes having early mating features, and having a basic grid of 2.5 mm in accordance with IEC 60917-1 (IEC 61076-4-111:2002); German version EN 61076-4-111:2002
电子设备连接器.第4-111部分:经质量评定的印制板连接器；符合IEC 60917-1（IEC 61076-4-1）要求的基本网格为2.5mm的印制板和背板用两件式电源连接器模块详细规范

2002-12-01

Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connector with integrated shielding function having a grid of 1 mm × 1.5 mm (IEC 61076-4-114:2003); German version EN 61076-4-114:2003
电子设备连接器.第4-114部分:印制板连接器.具有1mm×1.5mm栅极的集成屏蔽功能的两部分连接器详细规范（IEC 61076-4-114-2003）；德文版EN 61076-4-114:2003

2004-01-01

IEC 61076-4-108: Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1
IEC 61076-4-108:电子设备连接器-第4-108部分:经质量评定的印制板连接器-模块间距为25 mm且具有综合屏蔽功能的电缆-板连接器详细规范 适用于15 mm横向封装密度 基本网格为2.5 mm 符合IEC 60917-1

2002-02-14

Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality; Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2.5 mm in accordance with IEC 60917-1 (IEC 61076-4-108:2002); German version EN 61076-4-108:2002
电子设备连接器.第4-108部分:经质量评定的印制板连接器；适用于横向包装密度为15 mm、基本网格为2.5 mm in.的模块间距为25 mm、具有综合屏蔽功能的电缆板连接器详细规范

2002-12-01