SiP产品气密性封装设计指南
Design guidelines for hermetic package of SiP products

2018-01-18

包装印刷通用设计规范
Guidelines for packaging design enabling effective printing and finishing

2019-11-28

民用飞机综合模块化航空电子系统封装与接口的环境设计指南
Environmental design guideline for integrated modular avionics packaging and interfaces

2013-04-25

Acoustical Design Guidelines for Location of Packaged Rooftop Air Conditioners
成套屋顶空调器安装位置的声学设计指南

Integrated Passive Device (IPD) Chipscale Package Design Guidelines
集成无源器件（IPD）芯片级封装设计指南

1999-03-01

应急物资包装单元条码标签设计指南
Barcode label design guidelines for packaging unit of emergency materials

2022-10-12

포장과 환경 — KS T ISO 18600 시리즈에 기반한 제품 포장의 친환경 설계 자가평가 가이드라인
包装与环境——基于KS T ISO 18600系列标准的产品包装环境意识设计自评估指南

2024-01-29

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-16

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化

2011-08-31

Fibre optic active components and devices. Package and interface standards-Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
光纤有源元件和器件 包装和接口标准

2021-06-15

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 - 第6-8部分:表面贴装半导体器件封装外形图的一般规则 - 玻璃密封陶瓷四方扁平封装（g-qfp）设计指南

2001-08-27

Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
半导体器件的机械标准化第6-8部分:表面安装半导体器件封装外形图绘制的一般规则玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南

2002-06-28

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
光纤有源元件和器件.封装和接口标准.第21部分:使用硅细间距球栅阵列（S-FBGA）和硅细间距地栅阵列（S-FLGA）的PIC封装的电气接口设计指南

2021-04-22

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
光纤有源元件和器件.封装和接口标准.第21部分:使用硅细间距球栅阵列（S-FBGA）和硅细间距地栅阵列（S-FLGA）的PIC封装的电气接口设计指南

2021-04-22

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化 - 第6-12部分:表面贴装半导体器件封装外形图准备的一般规则 - 精细间距栅格阵列（FLGA）设计指南

2011-06-08

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则；玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南（IEC 60191-6-8-2001）；德文版EN 60191-6-8:2001

2002-05-01