Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
用于光纤系统应用的半导体光电器件第2部分:测量方法

2009-01-26

光纤系统用半导体光电子器件 第2部分：测量方法
Semiconductor optoelectronic devices for fibre optic system applications-Part 2:Measuring methods

2009-11-17

개별 반도체 소자 및 집적 회로— 제5-3부: 광전 소자 — 측정 방법
分立半导体器件和集成电路 - 第5-3部分:光电器件 - 测量方法

2020-12-24

用于光纤系统的半导体光电子器件 第2部分：测试方法

2011-12-20

광통신 시스템용 반도체 광전 소자 - 제2부 : 측정방법
光通信系统用半导体光电元件-第2部分:测量方法

2003-08-29

광통신 시스템용 반도체 광전 소자 - 제1부 : 중요 등급 및 특성
光纤系统应用的半导体光电器件 - 第一部分:基本额定值和特性

2003-08-29

Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
光纤系统用半导体光电器件.第1部分:基本额定值和特性的规范模板

2022-09-22

Amendment 1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
修改件1.光纤系统应用的半导体光电器件.第1部分:基本额定值和特性的规范模板

2022-09-22

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
半导体器件 - 微机电器件 - 第14部分:金属膜材料的成形极限测量方法

2012-02-28

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
半导体器件 - 微机电器件 - 第30部分:MEMS压电薄膜机电转换特性的测量方法

2017-09-15

Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
用于光纤系统应用的半导体光电子器件 - 第1部分:基本等级和特性的规范模板

2015-03-30

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
半导体器件 - 微机电器件 - 第26部分:微沟槽和针结构的描述和测量方法

2016-01-07

Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
半导体器件.微机电器件.第42部分:压电MEMS悬臂梁的机电转换特性的测量方法

2022-09-16

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
半导体器件.微机电器件.第47部分:硅基MEMS制造技术.微结构弯曲强度的测量方法

2024-08-23

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 - 微机电器件 - 第25部分:硅基存储器制造技术 - 微接合区域的拉压和剪切强度测量方法

2016-08-29

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016)
文件草稿-半导体器件-微机电器件-第30部分:MEMS压电薄膜机电转换特性的测量方法（IEC 47F/241/CD:2016）

2016-08-01

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
半导体器件.微机电器件.第14部分:金属薄膜材料的成形极限测量方法（IEC 62047-14-2012）；德文版EN 62047-14:2012

2012-10-01

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
半导体器件.微机电器件.第26部分:微沟槽和针形结构的描述和测量方法（IEC 62047-26-2016）；德文版EN 62047-26:2016

2016-12-01

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
半导体器件.微机电器件.第25部分:硅基MEMS制造技术.微键合区域拉压和剪切强度的测量方法（IEC 62047-25-2016）；德文版EN 62047-25:2016

2017-04-01

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）封装尺寸的测量方法（IEC 60191-6-20-2010）；德文版EN 60191-6-2

2011-03-01