现行

SJ/T 11126-1997

电子元件用酚醛系包封材料
Encapsulation materials of phenolic series for use in electronic components

1997-09-02

现行

GB/T 28859-2012

电子元器件用环氧粉末包封料
Encapsulating material of powdered epoxy for electronic components

2012-11-05

现行

SJ/T 11125-1997

电子元器件用环氧系灌封材料
Encapsulation materials of epoxy series for use in electronic components

1997-09-03

现行

SJ/T 11124-1997

电子元器件用环氧系粉末包封材料
Encapsulation materials of expoy series powder for use in electronic components

1997-09-02

现行

MIL MIL-P-46847B

PLASTIC MATERIAL, FOAMED POLYURETHANE FOR ENCAPSULATING ELECTRONIC COMPONENTS (SUPERSEDING MIL-P-46847A) (NO S/S DOCUMENT)
塑料材料 用于封装电子元件的泡沫聚氨酯（替代MIL-P-46847A）（无S/S文件）

1984-11-21

现行

MIL MIL-P-46847B Notice 1-Cancellation

PLASTIC MATERIAL, FOAMED POLYURETHANE FOR ENCAPSULATING ELECTRONIC COMPONENTS (SUPERSEDING MIL-P-46847A) (NO S/S DOCUMENT)
塑料材料 用于封装电子部件的泡沫聚氨酯（取代MIL-P-46847A）（无S/S文件）

1990-12-21

现行

BS EN 60286-4-2013

Packaging of components for automatic handling-Stick magazines for electronic components encapsulated in packages of different forms
自动搬运组件的包装

2013-11-30

现行

NAS 4120

Heat Sink, Electrical - Electronic Component, Semiconductor Devices, Encapsulating Type, To-5
封装型半导体器件电子元件电散热器To-5

1996-12-01

现行

IEC 60286-4-2013

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
自动处理组件的包装 - 第4部分:用于以不同形式包装的电子组件的粘贴杂志

2013-07-26

现行

UNE-EN 60286-4-2000

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING. PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF FORM E AND G.
用于自动搬运的组件包装 第4部分:封装在E型和G型包装中的电子元件用棒状弹匣

2000-11-21

现行

BS EN 60749-35-2006

Semiconductor devices. Mechanical and climatic test methods-Acoustic microscopy for plastic encapsulated electronic components
半导体器件 机械和气候试验方法

2006-11-30

现行

DIN 50456-3

Characterization of encapsulating compounds for electronic components used in semiconductor technology - Part 3: Determination of cationic impurities
半导体技术用电子元件封装化合物的特性第3部分:阳离子杂质的测定

1999-08-01

现行

BS CECC 00808-1996

Harmonized system of quality assessment for electronic components. Guidance document: use and application of plastic encapsulated devices
电子元件质量评定协调体系 指导文件:塑料封装设备的使用和应用

1996-08-15

现行

IEC 60749-35-2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
半导体器件 - 机械和气候测试方法第35部分:塑料封装电子元件的声学显微镜

2006-07-18

现行

GB/T 4937.35-2024

半导体器件 机械和气候试验方法 第35部分：塑封电子元器件的声学显微镜检查
Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components

2024-03-15

现行

KS M ISO 20536

신발 — 신발 및 신발 부품 내 잠재적으로 존재하는 유해물질 — 신발 재료 내 페놀 측정
鞋类潜在存在于鞋类和鞋类部件中的关键物质鞋类材料中苯酚的测定

2023-11-16

现行

ISO 20536-2017

Footwear — Critical substances potentially present in footwear and footwear components — Determination of phenol in footwear materials
鞋类 - 可能存在于鞋类和鞋类组分中的关键物质 - 鞋类材料中苯酚的测定

2017-09-28

现行

SJ 3262-1989

电子元件包封材料通用技术条件
General specification for packaging materials for use in electronic components

1989-03-20

现行

GB/T 5593-2015

电子元器件结构陶瓷材料
Structure ceramic materials used in electronic component and device

2015-05-15

现行

BS 10/30232398 DC

BS EN 60286-4. Packaging of components for automatic handling. Part 4. Stick magazines for electronic components encapsulated in packages of form E and G
英国标准EN 60286-4 用于自动搬运的组件包装 第四部分 用于封装在E和G型包装中的电子元件的棒式弹匣

2010-07-21