现行

IPC M-104

Standards for Printed Board Assembly Manual
印制板组装手册标准

现行

IPC M-105

Rigid Printed Board Manual
硬纸板手册

现行

SJ 20748-1999

刚性印制板及刚性印制板组装件设计标准
Design standard for rigid printed boards And rigid printed board assemblies

1999-11-10

现行

BS 6221-22-1990

Printed wiring boards-Guide to the use of printed wiring board substrate materials: surface mount technology
印刷线路板 印刷线路板基板材料使用指南:表面安装技术

1990-12-31

现行

IPC 6202

Performance guide Manual for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南手册

1999-10-01

现行

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

现行

IPC 2221B

Generic Standard on Printed Board Design
印制板设计通用标准

2012-11-01

现行

IPC 1602

Standard for Printed Board Handling and Storage
印制板搬运和贮存标准

2020-04-07

现行

IPC 4101E-WAM1

Specification for Base Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用基材规范

2020-04-01

现行

BS 4584-103.3-1992

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 印制板制造用永久性聚合物涂层材料（阻焊剂）规范

1992-03-31

现行

VDI/VDE 3709 Sheet 2

Artwork- and NC-data-generation for printed circuit board manufacturing; manual artwork generation
印刷电路板制造的艺术品和NC数据生成；手工艺术品生成

1987-11-01

现行

BS EN 61189-5-1-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Guidance for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法

2016-10-31

现行

IPC QL-653A

Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials
检查/测试印制板、组件和材料的设施的资质

1997-11-01

现行

SJ 21288-2018

埋入元件印制板用电阻材料规范
Specification of embedded component resistive materials for printed circuit boards

2018-01-18

现行

IPC TMRC-00R

2000 Analysis for Rigid Printed Wiring Boards and Related Materials
2000年刚性印制电路板和相关材料的分析

2000-01-01

现行

IPC 2224

Standard for Design of Printed Wiring Boards for PCMCIAs
PCMCIAs用印刷线路板设计标准

1998-01-01

现行

BS EN 61189-3-2008

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for interconnection structures (printed boards)
电气材料、印制板和其他互连结构和组件的试验方法

2008-03-31

现行

BS IEC 61189-5-3-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏

2015-01-31

现行

BS IEC 61189-5-2-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂

2015-01-31

现行

BS EN 61189-5-2-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂

2015-04-30