现行

KS D 8545

수지 플럭스 코어 무연 연납
树脂药芯焊丝无铅焊料

2018-12-17

现行

KS D 8545(2023 Confirm)

수지 플럭스 코어 무연 연납
树脂药芯无铅焊料

2018-12-17

现行

GB/T 20422-2018

无铅钎料
Lead-free solders

2018-05-14

现行

JB/T 6173-2014

免清洗无铅助焊剂
Fluxes for no-clean and lead-free

2014-05-12

现行

SJ/T 11697-2018

无铅元器件焊接工艺适应性规范
Applicability specification of soldering process for lead free component

2018-02-09

现行

ASM Sn-13

INDALLOY 227 - Lead-Free Solder
IND合金227-无铅焊料

1998-01-01

现行

YS/T 747-2010

无铅锡基焊料
Lead-free tin-based solder

2010-11-22

现行

IPC J-STD-006B

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
电子焊接用电子级焊料合金、助焊剂和非助焊剂的要求

2006-01-01

现行

JB/T 10845-2008

无铅再流焊接通用工艺规范
General technological specification for lead-free reflow soldering

2008-02-01

现行

BS PD IEC/TS 62647-3-2014

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统

2014-03-31

现行

SAE GEIASTD0005_1B

Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products
制定无铅控制计划以管理航空航天、国防和高性能焊接电子产品中无铅焊料和表面处理的风险的标准

2023-08-01

现行

KS D 8546

무연 연납 — 화학 조성과 형상
无铅软钎料合金 化学组成和形态

2018-12-17

现行

KS D 8546(2023 Confirm)

무연 연납 — 화학 조성과 형상
无铅软焊料合金.化学成分和形式

2018-12-17

现行

JIS Z 3198-6-2003

Test methods for lead-free solders -- Part 6: Methods for 45�pull test of solder joints on QFP lead
无铅焊料试验方法第6部分:QFP铅焊点45°拉力试验方法

2003-01-01

现行

GOST R 59681-2021

Сборка и монтаж электронных модулей. Припои, флюсы для пайки, припойные пасты. Марки, состав, свойства и область применения
组装和安装电子模块 焊料、助焊剂、焊膏 其类型、组成、性质及应用

现行

IEC TS 62647-3-2014

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第3部分:含无铅焊料和饰面的系统的性能试验

2014-02-25

现行

GB/T 41275.3-2022

航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分：含无铅焊料和无铅管脚的系统性能试验方法
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes

2022-03-09

现行

KS C IEC 61190-1-3(2016 Confirm)

전자 조립품용 부착 재료－제1－3부：전자 납땜 응용에 사용하는 전자등급 땜납합금과 플럭스 및 비플럭스 고형 땜납의 요구사항
电子组装用连接材料第1－3部分:电子焊接用电子级焊料合金及助熔剂和非助熔剂固体焊料的要求

2006-12-18

现行

KS C IEC 61190-1-3

전자부품 조립용 부착 재료 —제1-3부: 전자부품 솔더링 시 사용하는 전자등급 솔더 합금과 플럭스 및 비플럭스 고체 솔더의 요구사항
电子组装用连接材料.第1-3部分:电子焊接用电子级焊料合金和助焊剂和非助焊剂固体焊料的要求

2021-12-02

现行

IEC 61190-1-3-2017

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
电子组装用附件材料 - 第1-3部分:电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊剂的要求

2017-12-13