IEC 62137-1-4:2009中所述的试验方法适用于具有薄而宽基面的表面安装组件，如QFP和BGA。本试验方法通过基板的循环弯曲来评估基板上元件引线和焊环之间的焊接接头的耐久性。该测试还评估了重复机械应力的影响，如手机按键、组件端子和基板上焊盘之间的焊点强度。

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.