IEC 62258-2:20 11规定了可用于IEC 62258系列其他部分涵盖的数据交换的数据格式，以及根据IEC 61360的原理和方法使用的所有参数的定义。它引入了设备数据交换（DDX）格式，主要目标是促进模具制造商和CAD/CAE用户之间足够的几何数据的传输，以及允许以其他格式（例如符合ISO 10303-21的STEP物理文件格式）和XML进行数据交换的正式信息模型。数据格式有意保持灵活，以允许超出初始范围的使用。 它已经被开发为促进半导体管芯产品的生产、供应和使用，包括但不限于晶片、单片化裸管芯、具有附接连接结构的管芯和晶片、最小或部分封装的管芯和晶片。本标准反映了1.3.0版的DDX数据格式。关于第一版，此版本更新了几个参数。 本出版物应与IEC 62258-1:20 09一起阅读。

IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.

This publication is to be read in conjunction with IEC 62258-1:2009.