本技术报告旨在促进半导体芯片产品的生产、供应和使用，包括:晶片、单晶片裸片、晶片和晶片连接结构以及最小或部分封装的晶片和晶片。本报告包含一个XML模式，该模式描述了数据交换所需的元素，允许实现IEC 62258-1、IEC 62258-5和IEC 62258-6的要求，并提供了与IEC 62258-2中定义的交换结构互补的交换结构。它也是对IEC/TR 62258-4中问卷的补充和兼容。

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.