进行该测试是为了确定电线和其他部件是否能够承受焊接过程中（烙铁、浸锡、焊波或焊料回流）的热影响。热量既可以通过终端传导到部件中，也可以在靠近部件主体时从焊锡槽发出辐射热，或者两者兼而有之。在辐射热和传导热方面，焊料浸渍法被用作波峰焊条件的合理近似模拟。本试验还旨在评估组件可能暴露的回流技术的影响。 焊接热会导致焊料回流，这可能会影响部件的电气特性，并可能对组成部件的材料造成机械损坏，例如终端或绕组松动、绝缘软化、焊料密封件打开和机械接头弱化。

This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow). The heat can be either conducted heat through the termination into the component part, or radiant heat from the solder bath when in close proximity to the body of the component part, or both. The solder dip method is used as a reasonably close simulation of the conditions encountered in wave soldering, in regard to radiated and conducted heat. This test also is intended to evaluate the impact of reflow techniques to which components may be exposed. The heat of soldering can cause solder reflow which may affect the electrical characteristics of the component part and may cause mechanical damage to the materials making up the part, such as loosening of terminations or windings, softening of insulation, opening of solder seals, and weakening of mechanical joints.