现行

BS EN IEC 60068-2-20-2021

Environmental testing-Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境测试

2021-05-13

现行

GB/T 2424.17-2008

电工电子产品环境试验 第2部分：试验方法 试验T：锡焊试验导则
Environmental testing - Part 2: Tests methods guidance on - Test T: Soldering Test

2008-12-30

现行

GOST 28235-1989

Основные методы испытаний на воздействие внешних факторов. Часть 2. Испытания. Испытание Та: Пайка. Испытание на паяемость методом баланса смачивания
基本环境检测程序 测试 测试Ta:焊接 通过润湿平衡法进行可焊性试验

现行

KS C IEC 60068-2-20

환경시험 — 제2-20부: 시험 — 시험 T: 리드가 있는 소자의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验T:带引线器件的可焊性和耐焊接热的试验方法

2021-06-16

现行

JIS C 60068-2-20-2010

Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验T:带引线器件的可焊性和耐焊接热的试验方法

2010-01-01

现行

GOST R IEC 60068-2-20-2015

Испытания на воздействие внешних факторов. Часть 2-20. Испытания. Испытание Т. Методы испытания на паяемость и стойкость к воздействию нагрева при пайке устройств с соединительными проводами
环境试验 第2-20部分 测试 测试T.具有引线的器件的焊接性和耐焊接性的测试方法

现行

KS C IEC 60068-2-20

환경 시험 — 제2-20부: 시험 — 시험 Ta 및 Tb: 리드가 있는 부품의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法

2022-12-08

现行

IEC 60068-2-20-2021

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法

2021-03-30

现行

IEC 60068-2-20-2021 RLV

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验Ta和Tb试验:带引线器件的可焊性和耐焊接热的试验方法

2021-03-30

现行

BS EN 60068-2-58-2015+A1-2018

Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境测试

2018-05-21

现行

JIS C 0099-2005

Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
环境试验:试验——试验:用无铅焊膏润湿平衡法测定表面安装器件（SMD）可焊性的试验方法

2005-01-01

现行

SJ/Z 9001.32-1987

基本环境试验规程 第２部分：各种试验 试验Ｔａ：润湿秤量法可焊性试验
Basic environmental testing procedures--Part 2: Tests--Test Ta: Solderability testing by the wetting balance method

1987-11-27

现行

BS EN 60068-2-83-2011

Environmental testing-Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
环境测试

2011-11-30

现行

JIS C 60068-2-58-2002

Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2部分:试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法

2002-01-01

现行

GB/T 2423.32-2008

电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: Solderability test by the wetting balance method

2008-03-24

现行

KS C IEC 60068-2-58(2017 Confirm)

기본 환경시험 절차－제2－58부：시험－시험 Td：표면실장부품 (SMD)의 납땜성, 금속 내침식성 및 납땜 내열성 시험방법
环境试验—第2－58部分:试验—试验Td:表面贴装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法

2007-11-29

现行

KS C IEC 60068-2-58(2022 Confirm)

기본 환경시험 절차－제2－58부：시험－시험 Td：표면실장부품 (SMD)의 납땜성, 금속 내침식성 및 납땜 내열성 시험방법
环境试验－第2－58部分:试验－试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法

2007-11-29

现行

IEC 60068-2-58-2015

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境测试 - 第2-58部分:测试 - 测试Td:可焊性测试方法 金属化溶解性和表面贴装器件焊接热阻抗（smd）

2015-03-27

现行

IEC 60068-2-58-2015+AMD1-2017 CSV

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属化物溶解性和耐焊接热的试验方法

2017-07-28

现行

UNE-EN 60068-2-58-2006

Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属溶解性和耐焊接热的试验方法

2006-02-01