半导体集成电路 小外形封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for small outline package

2015-05-15

半导体集成电路 蚀刻型双列封装引线框架规范
Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

2013-12-31

半导体集成电路 塑料四面引线扁平封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

2015-05-15

半导体集成电路 塑料有引线片式载体封装引线框架规范
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package

2015-05-15

Semiconductor devices. Integrated circuits-Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 集成电路 不包括混合电路的半导体集成电路分规范

2011-07-31

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 - 集成电路 - 第11部分:不包括混合电路的半导体集成电路的分段规范

1990-12-20

반도체 소자 — 집적 회로 — 제11부:반도체 집적 회로에 대한 품종 규격(혼성 회로 제외)
半导体器件 - 集成电路 - 第11部分:不包括混合电路的半导体集成电路的分段规范

2020-07-23

半导体器件 集成电路 第11部分：半导体集成电路分规范（不包括混合电路）
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

2006-08-23

Semiconductor devices. Integrated circuits-Digital integrated circuits. Family specification. Low voltage integrated circuits
半导体器件 集成电路

2008-09-30

Amendment 2 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
修改件2.半导体器件.集成电路.第11部分:不包括混合电路的半导体集成电路分规范

1999-04-16

Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
修改件1.半导体器件.集成电路.第11部分:不包括混合电路的半导体集成电路分规范

1995-06-06

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
半导体器件 集成电路 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

1988-06-30

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范

2021-12-29

Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
电子元件质量评定协调体系 半导体器件 集成电路 不包括混合电路的半导体集成电路分规范 半导体集成电路（不包括混合电路）的内部目视检查

1992-08-15

宇航用半导体集成电路通用规范
General specification for semiconductor integrated circuit of space applications

2008-02-16

半导体集成电路陶瓷针栅阵列外壳 详细规范
Detail specification of ceramic PGA for semiconductor integrated circuits

2003-06-04

半导体集成电路Jμ8086型微处理器详细规范
Detail specification of Ju8086 microprocessor for semiconductor integrated circuits

1992-11-19

半导体集成电路微处理器空白详细规范 （可供认证用）
Blank detail specification for microprocessor semiconductor integrated circuits

1987-03-25