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现行 BS IEC 62047-35:2019
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Semiconductor devices. Micro-electromechanical devices-Test method of electrical characteristics under bending deformation for flexible electromechanical devices 半导体器件 微机电设备
发布日期: 2021-04-20
IEC 62047的本部分规定了柔性机电设备弯曲变形下电气特性的试验方法。这些器件包括柔性膜上或嵌入柔性膜中的无源微组件和/或有源微组件。试验方法所需的装置平面内尺寸范围通常为1 mm至300 mm,厚度范围为10µm至1 mm,但这些不是限制值。试验方法的设计应确保以准静态方式单调弯曲装置,直至达到最大可能曲率,即:。 e、 直到装置完全折叠,从而获得弯曲变形下电性能的整体退化行为。本文件对于估算特定弯曲变形下的安全裕度至关重要,对于采用这些装置的产品的可靠设计必不可少。购买本文件时可获得的所有当前修订均包含在购买本文件中。
This part of IEC 62047 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 µm to 1 mm, but these are not limiting values. The test method is so designed as to bend devices in a quasi-static manner monotonically up to the maximum possible curvature, i.e. until the device is completely folded, so that the entire degradation behaviour of the electric property under bending deformation is obtained. This document is essential to estimate the safety margin under a certain bending deformation and indispensable for reliable design of the product employing these devices.All current amendments available at time of purchase are included with the purchase of this document.
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发布单位或类别: 英国-英国标准学会
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