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现行 BS EN 61249-2-12:1999
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Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Epoxide non-woven aramid laminate of defined flammability, copper-clad 互连结构材料 包覆和未包覆增强基材分规范集 规定可燃性的覆铜环氧无纺布芳纶层压板 规定可燃性的覆铜环氧无纺布芳纶层压板
发布日期: 1999-05-16
交叉引用:IEC 61189-1IEC 61189-3IEC 61189-2:1997IEC 61249-5-1:1995EN 61189-2:1997EN 61189-2:1997/CoreN 61249-5-1:1996
Cross References:IEC 61189-1IEC 61189-3IEC 61189-2:1997IEC 61249-5-1:1995EN 61189-2:1997EN 61189-2:1997/CorEN 61249-5-1:1996
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发布单位或类别: 英国-英国标准学会
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研制信息
相似标准/计划/法规
现行
BS EN 61249-7-1-1996
Materials for interconnection structures. Sectional specification set for restraining core materials-Copper/invar/copper
互连结构材料 约束型芯材料的分规范集 铜/因瓦/铜
1996-08-15
现行
IEC 61249-7-1-1995
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
互连结构材料 - 第7部分:限制核心材料的部分规范 - 第1节:铜/殷钢/铜
1995-04-26
现行
UNE-EN 61249-7-1-1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
互连结构材料 第7部分:约束芯材的分规范集 第1节:铜/因瓦/铜
1997-10-17
现行
BS EN 61249-8-7-1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings-Marking legend inks
互连结构材料 非导电薄膜和涂层分规范集 标记图例墨水
1997-03-15
现行
BS EN 61249-5-4-1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings-Conductive inks
互连结构材料 带涂层和不带涂层的导电箔和膜的分规范集 导电油墨
1997-05-15
现行
BS EN 61249-8-8-1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings-Temporary polymer coatings
互连结构材料 非导电薄膜和涂层分规范集 临时聚合物涂层
1997-12-15
现行
IEC 61249-8-7-1996
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
互连结构材料 - 第8部分:非导电膜和涂层的部分规范 - 第7节:标记图例油墨
1996-04-26
现行
IEC 61249-8-8-1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
互连结构材料 - 第8部分:非导电膜和涂层的分段规范 - 第8节:临时聚合物涂层
1997-06-24
现行
IEC 61249-5-4-1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
互连结构材料第5部分:带或不带涂层的导电箔和薄膜的分规范 - 第4节:导电油墨
1996-06-18
现行
UNE-EN 61249-8-8-2000
Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
互连结构材料第8部分:非导电薄膜和涂层分规范第8节:临时聚合物涂层
2000-11-21
现行
UNE-EN 61249-8-7-1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
互连结构材料 第8部分:非导电薄膜和涂层分规范集 第7节:标记图例墨水
1997-10-17
现行
UNE-EN 61249-5-4-1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.
互连结构材料 第5部分:带或不带涂层的导电箔和薄膜分规范集 第4节:导电油墨
1997-11-05
现行
BS EN 61249-5-1-1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings-Copper foils (for the manufacture of copper-clad base materials)
互连结构材料 带涂层和不带涂层的导电箔和膜的分规范集 铜箔(用于制造覆铜基材)
1996-09-15
现行
IEC 61249-5-1-1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
互连结构材料 - 第5部分:带和不含涂层的导电箔和薄膜的剖面规格 - 第1节:铜箔(用于制造铜包基材料)
1995-11-28
现行
BS EN 61249-3-3-1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料 包覆和未包覆的非增强基材分规范集(适用于柔性印制板) 涂有粘合剂的柔性聚酯薄膜 涂胶柔性聚酯薄膜
1999-06-15
现行
BS EN 61249-2-13-1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
互连结构材料 包覆和非包覆增强基材分规范集
1999-06-15
现行
BS EN 61249-3-5-1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Transfer adhesive films for flexible printed boards
互连结构材料 覆层和非覆层非增强基材分规范集(适用于柔性印制板)
1999-06-15
现行
IEC 61249-6-3-2023
Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范
2023-06-14
现行
BS EN 61249-4-1-2008
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
印制板和其他互连结构用材料
2008-07-31
现行
IEC 61249-4-2-2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
印刷电路板及其他互连结构材料 - 第4-2部分:预浸材料的分段规格书 未包装 - 多功能环氧化物编织的易燃玻璃预浸料
2005-09-05