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现行 BS EN 61249-8-7:1997
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Materials for interconnection structures. Sectional specification set for non-conductive films and coatings-Marking legend inks 互连结构材料 非导电薄膜和涂层分规范集 标记图例墨水
发布日期: 1997-03-15
给出了用于印制板的图例和其他标识的标记墨水的鉴定要求。提供以标记油墨为特征的印制板适用性指南。交叉引用:IEC 326-6-1IEC 1189-1IEC 1189-2IEC 1189-3BS 2011:第2.1CaBS 2011:第2.1TB 2011:第2.1Z/ADBS 6221部分:第2BS EN 60068-2-2部分
Gives the requirements for the qualification of marking inks used for legends and other identifications used for printed boards. Provides guidance on the suitability of printed boards which feature marking inks.Cross References:IEC 326-6-1IEC 1189-1IEC 1189-2IEC 1189-3BS 2011:Part 2.1CaBS 2011:Part 2.1TBS 2011:Part 2.1Z/ADBS 6221:Part 2BS EN 60068-2-2
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发布单位或类别: 英国-英国标准学会
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相似标准/计划/法规
现行
BS EN 61249-7-1-1996
Materials for interconnection structures. Sectional specification set for restraining core materials-Copper/invar/copper
互连结构材料 约束型芯材料的分规范集 铜/因瓦/铜
1996-08-15
现行
IEC 61249-7-1-1995
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
互连结构材料 - 第7部分:限制核心材料的部分规范 - 第1节:铜/殷钢/铜
1995-04-26
现行
UNE-EN 61249-7-1-1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
互连结构材料 第7部分:约束芯材的分规范集 第1节:铜/因瓦/铜
1997-10-17
现行
BS EN 61249-5-4-1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings-Conductive inks
互连结构材料 带涂层和不带涂层的导电箔和膜的分规范集 导电油墨
1997-05-15
现行
BS EN 61249-8-8-1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings-Temporary polymer coatings
互连结构材料 非导电薄膜和涂层分规范集 临时聚合物涂层
1997-12-15
现行
UNE-EN 61249-5-4-1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.
互连结构材料 第5部分:带或不带涂层的导电箔和薄膜分规范集 第4节:导电油墨
1997-11-05
现行
IEC 61249-8-7-1996
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
互连结构材料 - 第8部分:非导电膜和涂层的部分规范 - 第7节:标记图例油墨
1996-04-26
现行
IEC 61249-8-8-1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
互连结构材料 - 第8部分:非导电膜和涂层的分段规范 - 第8节:临时聚合物涂层
1997-06-24
现行
IEC 61249-5-4-1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
互连结构材料第5部分:带或不带涂层的导电箔和薄膜的分规范 - 第4节:导电油墨
1996-06-18
现行
UNE-EN 61249-8-8-2000
Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
互连结构材料第8部分:非导电薄膜和涂层分规范第8节:临时聚合物涂层
2000-11-21
现行
UNE-EN 61249-8-7-1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
互连结构材料 第8部分:非导电薄膜和涂层分规范集 第7节:标记图例墨水
1997-10-17
现行
BS EN 61249-5-1-1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings-Copper foils (for the manufacture of copper-clad base materials)
互连结构材料 带涂层和不带涂层的导电箔和膜的分规范集 铜箔(用于制造覆铜基材)
1996-09-15
现行
IEC 61249-5-1-1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
互连结构材料 - 第5部分:带和不含涂层的导电箔和薄膜的剖面规格 - 第1节:铜箔(用于制造铜包基材料)
1995-11-28
现行
BS EN 61249-2-12-1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Epoxide non-woven aramid laminate of defined flammability, copper-clad
互连结构材料 包覆和未包覆增强基材分规范集 规定可燃性的覆铜环氧无纺布芳纶层压板 规定可燃性的覆铜环氧无纺布芳纶层压板
1999-05-16
现行
BS EN 61249-3-3-1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料 包覆和未包覆的非增强基材分规范集(适用于柔性印制板) 涂有粘合剂的柔性聚酯薄膜 涂胶柔性聚酯薄膜
1999-06-15
现行
BS EN 61249-3-5-1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Transfer adhesive films for flexible printed boards
互连结构材料 覆层和非覆层非增强基材分规范集(适用于柔性印制板)
1999-06-15
现行
BS EN 61249-2-13-1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad-Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
互连结构材料 包覆和非包覆增强基材分规范集
1999-06-15
现行
IEC 61249-6-3-2023
Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范
2023-06-14
现行
BS EN 61249-4-1-2008
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
印制板和其他互连结构用材料
2008-07-31
现行
IEC 61249-4-2-2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
印刷电路板及其他互连结构材料 - 第4-2部分:预浸材料的分段规格书 未包装 - 多功能环氧化物编织的易燃玻璃预浸料
2005-09-05