Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
电子组装技术.第4部分:面阵型封装表面安装器件焊点的耐久性试验方法(IEC 62137-4-2014);德文版EN 62137-4:2014+AC:2015