现行

GB/T 14844-2018

半导体材料牌号表示方法
Designations of semiconductor materials

2018-12-28

现行

GB/T 14264-2024

半导体材料术语
Terminology of semiconductor materials

2024-04-25

现行

JEDEC JESD 370B(R2003)

DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
半导体器件命名系统

1982-02-01

现行

GOST 22622-1977

Материалы полупроводниковые. Термины и определения основных электрофизических параметров
半导体材料 术语和定义

现行

GB/T 31469-2015

半导体材料切削液
Semiconductor materials cutting fluid

2015-05-15

现行

GOST 26284-1984

Преобразователи электроэнергии полупроводниковые. Условные обозначения
半导体电源转换器 常规名称

现行

BS IEC 62899-203-2018

Printed electronics-Materials. Semiconductor ink
印刷电子产品

2018-10-10

现行

IPC J-STD-026

Semiconductor Design Standard for Flip Chip Applications
倒装芯片应用的半导体设计标准

1999-04-01

现行

EIA/JESD 30B

Descriptive Designation System for Semiconductor-Device Packages
半导体器件封装的描述命名系统

1995-04-01

现行

HI-85-20-3

Design Considerations for Distribution of Gases in Semiconductor Facilities
半导体设备中气体分布的设计考虑

现行

GB/T 249-2017

半导体分立器件型号命名方法
The rule of type designation for discrete semiconductor devices

2017-05-12

现行

SJ/T 11067-1996

红外探测材料中半导体光电材料和热释电材料常用名词术语
Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials

1996-11-20

现行

2006 No. 1833

The Design Right (Semiconductor Topographies) (Amendment) Regulations 2006
2006年设计权（半导体拓朴）（修订）规例

现行

SJ/T 10607-1994

半导体集成电路门阵列设计总则
Gate array design generals for semiconductor integrated circuits

1994-10-11

现行

JEDEC JESD 321-C(R2009)

NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICES
半导体器件中同名终端功能的编号和多单元半导体器件中单元的命名

1987-02-01

现行

BS IEC 62951-5-2019

Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for thermal characteristics of flexible materials
半导体器件 柔性可伸缩半导体器件

2019-03-05

现行

DIN 50439

Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
半导体技术材料测试；用电容电压法和汞接触法测定单晶半导体材料的掺杂浓度分布

1982-10-01

现行

KS C IEC 62899-203

인쇄전자 — 제203부: 재료 — 반도체 잉크
印刷电子产品第203部分:材料半导体油墨

2023-11-17

现行

IEC 62899-203-2024 RLV

Printed electronics - Part 203: Materials - Semiconductor ink
印刷电子产品.第203部分:材料.半导体油墨

2024-05-28

现行

IEC 62899-203-2024

Printed electronics - Part 203: Materials - Semiconductor ink
印刷电子产品.第203部分:材料.半导体油墨

2024-05-28