现行

MIL MIL-PRF-38535L

Integrated Circuits (Microcircuits) Manufacturing, General Specification for
集成电路（微电路）制造通用规范

2018-12-06

现行

MIL MIL-PRF-38535J Amendment 1(amendment incorporated)

Integrated Circuits (Microcircuits) Manufacturing, General Specification for
集成电路（微电路）制造通用规范

2012-05-14

现行

MIL MIL-PRF-38535E Amendment 5

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-I-38535D) (S/S BY MIL-PRF-38535F)
集成电路（微电路）制造（取代MIL-I-38535D）的通用规范

2001-01-16

现行

MIL MIL-PRF-38535E Amendment 1

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-I-38535D) (S/S BY MIL-PRF-38535F)
集成电路（微电路）制造（取代MIL-I-38535D）的通用规范

1998-10-23

现行

MIL MIL-PRF-38535E Amendment 2

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-I-38535D) (S/S BY MIL-PRF-38535F)
集成电路（微电路）制造（取代MIL-I-38535D）的通用规范

1999-06-22

现行

MIL MIL-PRF-38535E Amendment 4

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-I-38535D) (S/S BY MIL-PRF-38535F)
集成电路（微电路）制造（取代MIL-I-38535D）的通用规范

2000-02-18

现行

MIL MIL-PRF-38535E Amendment 3

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-I-38535D) (S/S BY MIL-PRF-38535F)
集成电路（微电路）制造（取代MIL-I-38535D）的通用规范

1999-11-05

现行

BS IEC 60748-23-1-2002

Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification-Generic specification
半导体器件 集成电路 混合集成电路和薄膜结构 生产线认证

2002-06-07

现行

GOST R 53432-2009

Платы печатные. Общие технические требования к производству
印刷电路板 一般技术要求制造

现行

IEC 60748-23-1-2002

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
半导体器件 - 集成电路 - 第23-1部分:混合集成电路和薄膜结构 - 制造线认证 - 通用规范

2002-05-15

现行

KS C IEC 60748-23-1(2019 Confirm)

반도체 소자－집적 회로－제23－1부：하이브리드 집적 회로 및 필름 구조－제조 라인 인증－일반 시방서
半导体器件集成电路第23－1部分:混合集成电路和薄膜结构生产线认证总规范

2004-11-30

现行

GB/T 43338-2023

制造服务 业务数据集成通用要求
Manufacturing services—General requirements of scientific business data integration

2023-11-27

现行

GB/T 38345-2019

宇航用半导体集成电路通用设计要求
General design requirements of semiconductor integrate circuit for space application

2019-12-31

现行

GOST 18683.0-1983

Микросхемы интегральные цифровые. Общие требования при измерении электрических параметров
数字集成电路 测量电气参数的一般要求

现行

GB/T 43961-2024

制造系统诊断维护技术与应用集成通用要求
General integration requirements of technologies and applications for diagnostics and maintenance in manufacturing systems

2024-04-25

现行

KS C IEC 60748-20-1(2019 Confirm)

반도체 소자 - 집적회로 제20-1부 : 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서 - 내부 육안검사 요구사항
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范 - 第1部分:内部目视检查的要求

2003-12-31

现行

IEC 60748-20-1-1994

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范 - 第1部分:内部目视检查的要求

1994-03-01

现行

GB/T 43035-2023

半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求
Semiconductor devices—Integrated circuits—Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits—Section 1: Requirements for internal visual examination

2023-09-07

现行

GOST R 50562-1993

Оригиналы и фотошаблоны печатных плат. Общие требования к типовым технологическим процессам изготовления
印刷电路板的原稿和标记 单位制造方法的一般要求

现行

GOST 24613.0-1981

Микросхемы интегральные оптоэлектронные и оптопары. Общие положения при измерении электрических параметров
光电集成微电路和光耦 电气参数测量的一般要求