IEC 60068的本部分概述了测试Te/Tc、锡槽润湿平衡法和焊球润湿平衡法，以定量确定终端的可焊性。通过这些方法获得的数据不打算用作通过-失败目的的绝对定量数据。 这些程序描述了锡槽润湿平衡法和焊球润湿平衡法。它们适用于带有金属终端和金属化焊盘的元件和印制板。 本文件提供了含铅和不含铅的焊接合金的测量程序。交叉引用:IEC 60068-1:2013IEC 61190-1-3:2007ISO 683-17:1999IEC 60068-2-66:1994ISO 683-1:2016IEC 61190-1-3:2007/AMD1:2010ISO 683-4:2014IEC 60068-2-20:2008ISO 683-3:2016ISO 683-2:2016IEC 60068-2-2:2007ISO 683-4:2016IPC J-STD-003CISO 6362-4:2012ISO 6362- 6:2012ISO 9453:2014IEC 60068-3-13:2016ISO 9454-1:1990ISO 6362-2:2014ISO 6362-1:2012IEC 61190-1-1:2002ISO 6362-3:2012ISO 6362-7:2012ISO 6362-5:2012包含以下内容:修订，2019年9月；勘误表，2018年5月

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).Cross References:IEC 60068-1:2013IEC 61190-1-3:2007ISO 683-17:1999IEC 60068-2-66:1994ISO 683-1:2016IEC 61190-1-3:2007/AMD1:2010ISO 683-4:2014IEC 60068-2-20:2008ISO 683-3:2016ISO 683-2:2016IEC 60068-2-2:2007ISO 683-4:2016IPC J-STD-003CISO 6362-4:2012ISO 6362-6:2012ISO 9453:2014IEC 60068-3-13:2016ISO 9454-1:1990ISO 6362-2:2014ISO 6362-1:2012IEC 61190-1-1:2002ISO 6362-3:2012ISO 6362-7:2012ISO 6362-5:2012Incorporates the following:Amendment, September 2019; Corrigendum, May 2018