粮食信息分类与编码　粮食行政、事业机构及社会团体分类与代码
Classification and codes of grain information—Classification and codes of grain administration organization

2004-04-22

公安信息代码　第159部分：公安机关单位性质类别代码
Information codes for public security industry—Part 159:Codes for classification of characteristics of public security organs

2018-05-07

公安信息代码　第168部分：公安机关工作岗位类别代码
Information codes for public security industry—Part 168:Codes for classification of jobs in public security organs

2018-05-07

公安信息代码　第161部分：公安机关工作人员身份类别代码
Information codes for public security industry—Part 161:Codes for classification of staff identities of public security organs

2018-05-07

公安信息代码　第160部分：公安机关部门类别代码
Information codes for public security industry—Part 160:Codes for classification of characteristics of departments in public security organs

2018-05-07

公安信息代码　第82部分：共同犯罪犯罪嫌疑人组合形式代码
Information codes for public security industry—Part 82:Classification and codes for combination forms of criminal suspects in a joint crime

2015-12-30

全国组织、干部、人事管理信息 第2部分：信息分类代码集
Information for national organization, cadre and personnel management—Part 2: Information classification and code lists

2019-08-30

公安信息代码　第200部分：兼任公安机关主要领导类型代码
Information codes for public security industry—Part 200:Codes for classification of concurrent posts for main leaders in public security organs

2018-05-02

Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化

2018-05-30

半导体器件的机械标准化 第４部分：半导体器件封装外形图类型的划分以及编号体系
Mechanical standardization of semiconductor devices--Part 4: Coding system and classification into forms of package outlines for semiconductor devices

1987-09-14

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化 - 第4部分:编码系统和分类为半导体器件封装的封装轮廓形式

2013-10-10

Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
半导体器件机械标准化第4部分:半导体器件封装外形的编码系统和分类

2001-01-23

半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2019-08-30

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
文件草稿.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类形式（IEC 47D/769/CD:2010）

2010-07-01