现行

GOST R IEC 60068-2-54-2017

Испытания на воздействие внешних факторов. Часть 2-54. Испытания. Испытание Ta: Испытание на паяемость электронных компонентов методом баланса смачивания
环境试验 第2-54部分 测试Ta:通过润湿平衡法进行电子元件的焊接性测试

现行

UNE-EN 60068-2-54-2007

Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006)
环境试验第2-54部分:试验试验Ta:用湿平衡法对电子元件进行可焊性试验（IEC 60068-2-54-2006）

2007-04-11

现行

GOST 28235-1989

Основные методы испытаний на воздействие внешних факторов. Часть 2. Испытания. Испытание Та: Пайка. Испытание на паяемость методом баланса смачивания
基本环境检测程序 测试 测试Ta:焊接 通过润湿平衡法进行可焊性试验

现行

SJ/Z 9001.32-1987

基本环境试验规程 第２部分：各种试验 试验Ｔａ：润湿秤量法可焊性试验
Basic environmental testing procedures--Part 2: Tests--Test Ta: Solderability testing by the wetting balance method

1987-11-27

现行

KS C IEC 60068-2-20

환경 시험 — 제2-20부: 시험 — 시험 Ta 및 Tb: 리드가 있는 부품의 땜질성 및 땜질 내열성 시험방법
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法

2022-12-08

现行

IEC 60068-2-20-2021

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法

2021-03-30

现行

IEC 60068-2-20-2021 RLV

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
环境试验第2-20部分:试验Ta和Tb试验:带引线器件的可焊性和耐焊接热的试验方法

2021-03-30

现行

GB/T 2423.32-2008

电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: Solderability test by the wetting balance method

2008-03-24

现行

UNE-EN 60068-2-44-1996

ENVIRONMENTAL TESTING. PART 2: TESTS. GUIDANCE ON TEST T: SOLDERING.
环境测试 第2部分:测试 测试指南T:焊接

1996-07-10

现行

IEC 60068-2-69-2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
环境试验.第2-69部分:试验.试验Te/Tc:用润湿平衡（力测量）法对电子元件和印制板的可焊性试验

2017-03-07

现行

IEC 60068-2-69-2017+AMD1-2019 CSV

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2019-06-19

现行

JIS C 60068-2-69-2019

Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2019-01-01

现行

SJ/Z 9001.39-1987

基本环境试验规程 第２部分：各种试验 锡焊试验导则
Basic environmental testing procedures--Part 2: Tests--Guidance on soldering tests

1987-11-27

现行

SJ/Z 9001.31-1987

基本环境试验规程 第２部分：各种试验 试验Ｔ：锡焊
Basic environmental testing procedures--Part 2: Tests--Test T: Soldering

1987-11-27

现行

UNE 20501-2-20-1994

BASIC ENVIRONMENTAL TESTING PROCEDURES. PART 2: TESTS. TEST T: SOLDERING.
基本环境测试程序 第2部分:测试 测试T:焊接

1994-01-20

现行

GOST 28211-1989

Основные методы испытаний на воздействие внешних факторов. Часть 2. Испытания. Испытание Т: Пайка
基本环境检测程序 测试 测试T:焊接

现行

GB/T 2424.17-2008

电工电子产品环境试验 第2部分：试验方法 试验T：锡焊试验导则
Environmental testing - Part 2: Tests methods guidance on - Test T: Soldering Test

2008-12-30

现行

BS 05/30139830 DC

IEC 60068-2-69 ED 2. Environmental testing. Part 2-69. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
IEC 60068-2-69第2版 环境测试 第2-69部分 测验 测试Te 用润湿平衡法测试表面贴装器件（SMD）用电子元件的可焊性

2005-10-04

现行

DIN EN IEC 60068-2-20

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2021); German version EN IEC 60068-2-20:2021
环境试验.第2-20部分:试验.试验Ta和Tb:带引线器件的可焊性和耐焊接热的试验方法（IEC 60068-2-20:2021）；德语版本EN IEC 60068-2-20:2021

2022-07-01

现行

IEC 60068-2-69-2017/AMD1-2019

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
修改件1.环境试验.第2-69部分:试验.试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2019-06-19