该行业关于印制板搬运、包装和储存的唯一指南。本文件中的指南旨在保护印制板免受污染、物理损坏、可焊性退化和吸湿。考虑到包装材料类型和方法、生产环境、产品的搬运和运输，以及建立用于去除水分的烘焙轮廓。修订版A扩大了防潮袋（MBB）的覆盖范围、烘烤对印制板可焊性的影响、ESD问题、蚀刻芯和复合材料的水分问题、干燥剂材料和HIC卡，以及包装和搬运要求的示例流程。

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. Revision A provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example flowndowns of packaging and handling requirements.