首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IPC CM-770E
到馆提醒
收藏跟踪
购买正版
Component Mounting Guidelines for Printed Boards 印制板元件安装指南
发布日期: 2004-01-01
展示印制电路板组件准备的有效指南,并审查相关设计标准、影响和问题。包含组装技术(包括手工和机器,包括SMT和倒装芯片),以及对后续焊接、清洁和涂层过程的考虑和影响。
Demonstrates effective guidelines in the preparation of components for assembly of printed wiring boards and reviews pertinent design criteria, impacts and issues. Contains techniques for assembly (both manual and machines including SMT and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes.
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
IPC D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
可靠表面安装技术印制板组件的设计指南
1996-08-01
现行
IPC TR-551
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
电子元件安装和互连用印制板的质量评估
1993-07-01
现行
UNE 20552-1975
DESIGN AND USE OF COMPONENTS INTENTED FOR MOUNTING ON BOARD WITH WIRING AND PRINTED CIRCUITS
设计和使用拟安装在带有布线和印刷电路板上的组件
1975-06-15
现行
IPC DR-572A
Drilling Guidelines for Printed Boards
印制板钻孔指南
2007-03-01
现行
BS PD IEC TR 61191-7-2020
Printed board assemblies-Technical cleanliness of components and printed board assemblies
印制板组件
2020-03-23
现行
IPC CH-65B
Guidelines for Cleaning of Printed Boards and Assemblies
印制板和组件清洁指南
2011-07-01
现行
IPC 1601A
Printed Board Handling and Storage Guidelines
印制板搬运和储存指南
2016-06-01
现行
IPC 5703
Cleanliness Guidelines for Printed Board Fabricators
印制板制造商的清洁指南
2013-05-01
现行
IEC TR 61191-7-2020
Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
印制板组件.第7部分:组件和印制板组件的技术清洁度
2020-03-11
现行
CB 20104-2012
水雷印制板表面组装要求
Requirements of surface mount for mine printed boards
2013-01-04
现行
BS 6221-23-1991
Printed wiring boards-Guide for the design and use of printed wiring boards: surface mounted devices
印刷线路板 印刷线路板的设计和使用指南:表面安装设备
1991-02-28
现行
BS 6221-25-2000
Printed wiring boards-Guide to the rework and repair of soldered surface mounted printed board assemblies
印刷线路板 焊接表面安装印刷电路板组件的返工和修理指南
2000-11-15
现行
BS 6221-22-1990
Printed wiring boards-Guide to the use of printed wiring board substrate materials: surface mount technology
印刷线路板 印刷线路板基板材料使用指南:表面安装技术
1990-12-31
现行
IPC 4563
Resin Coated Copper Foil for Printed Boards Guideline
印制板用树脂涂覆铜箔指南
2007-11-01
现行
SJ 21285-2018
埋入元件印制板设计要求
Design requirements for embedded components of printed circuit boards
2018-01-18
现行
QB/T 1905-2012
指针式石英表用线路板组件
Printed circuit board component for analogue quartz watches
2012-11-07
现行
BS EN 61188-7-2017
Printed boards and printed board assemblies. Design and use-Electronic component zero orientation for CAD library construction
印制板和印制板组件 设计和使用
2017-09-28
现行
BS EN IEC 61188-6-4-2019
Printed boards and printed board assemblies. Design and use-Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
印制板和印制板组件 设计和使用
2019-07-12
现行
IPC QL-653A
Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials
检查/测试印制板、组件和材料的设施的资质
1997-11-01
现行
BS 6943-1988
Classification of shapes of electronic components for placement on printed wiring boards
印制电路板上电子元件形状分类
1988-09-30