封装键合用镀金银及银合金丝
Gold-coated silver and silver alloy bonding wires for semiconductor package

2017-09-29

半导体封装用金基键合丝、带
Gold-based bonding wire and bandlet for semiconductor package

2022-12-30

封装键合用镀钯铜丝
Palladium coated copper bonding wire for semiconductor package

2017-10-14

半导体器件键合用铜丝
Copper wire for semiconductor lead bonding

2008-03-12

半导体器件键合用铝丝
Aluminium wire for semiconductor lead bonding

2007-04-13

Standard Specification for Gold Wire for Semiconductor Lead Bonding
半导体引线键合用金线的标准规范

2024-04-01

半导体器件键合丝表面质量检验方法
Standard practice for inspection of surface quality of semiconductor lead-bonding wire

1996-07-22

半导体键合用铝-1%硅细丝
Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding

2015-04-30

键合金丝中微量杂质的ICP发射光谱分析方法
Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES

1995-04-22

集成电路陶瓷封装金丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for gold wire bonding process

2018-01-18

集成电路陶瓷封装硅铝丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for aluminum-silicon wire bonding process

2018-01-18

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
半导体器件的机械标准化 - 第5部分:使用磁带自动焊接（集成电路）应用于集成电路封装的建议

1997-04-23