挠性印制电路用涂胶聚酰亚胺薄膜
Adhesive coated polyimide film for flexible printed circuits

2017-12-29

挠性印制电路用涂胶聚酯薄膜
Adhesive coated polyester film for flexible printed circuits

2017-12-29

挠性印制电路用聚酰亚胺薄膜覆铜板
Copper-clad polyimide film laminates for flexible printed circuits

2017-12-29

Base material for printed circuits. Specifications-Flexible copper-clad polyimide film, general purpose grade
印刷电路的基材 规格 通用级挠性覆铜聚酰亚胺薄膜

1990-02-28

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
印制板和其他互连结构用材料.第3-4部分:包层和非包层（用于柔性印制板）无增强基材的分规范集.涂有粘合剂的柔性聚酰亚胺薄膜

1999-02-10

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
印制板和其他互连结构用材料 第3-4部分:覆层和非覆层（用于柔性印制板）无加强基材分规范集 胶粘剂涂覆柔性聚酰亚胺薄膜

2000-11-17

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-10-14

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-10-16

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料 包覆和未包覆的非增强基材分规范集（适用于柔性印制板） 涂有粘合剂的柔性聚酯薄膜 涂胶柔性聚酯薄膜

1999-06-15

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
印制板和其他互连结构用材料.第3-3部分:包覆和非包覆（柔性印制板用）无增强基材的分规范集.涂粘合剂的柔性聚酯薄膜

1999-02-10

Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
印制板和其他互连结构用材料第3-3部分:覆层和非覆层（用于柔性印制板）非增强基材分规范集涂有粘合剂的柔性聚酯薄膜

2000-12-04

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyimide film (IEC 61249-3-4:1999); German version EN 61249-3-4:1999
印制板和其他互连结构用材料.第3-4部分:覆层和非覆层（用于柔性印制板）无增强基材分规范集；涂有粘合剂的柔性聚酰亚胺薄膜（IEC 61249-3-4-1999）；德文版EN 61249-3-4:1999

1999-11-01

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyester film (IEC 61249-3-3:1999); German version EN 61249-3-3:1999
印制板和其他互连结构用材料.第3-3部分:覆层和非覆层（用于柔性印制板）无增强基材分规范集；涂有粘合剂的柔性聚酯薄膜（IEC 61249-3-3-1999）；德文版EN 61249-3-3:1999

1999-11-01