BS EN 60749-9:2017旨在确定固态材料上的标记 当应用和移除半导体器件时，半导体器件将保持清晰可辨 标签或使用溶剂和清洗溶液通常用于去除 印刷电路板制造过程中的焊剂残留物。本试验适用于所有包装类型。适用于资格认证和/或认证 过程监控测试。该测试被认为是非破坏性的。电气或机械 不合格品可用于本试验。交叉引用:IEC 61340- 2-3:2016EN 61340-2-3（IEC 61340-2-3:2016）ASFED-STD-101CAll购买时可用的当前修订版包含在本文件的购买中。

BS EN 60749-9:2017 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.Cross References:IEC 61340-2-3:2016EN 61340-2-3 (IEC 61340-2-3:2016) ASFED-STD-101CAll current amendments available at time of purchase are included with the purchase of this document.