Semiconductor devices. Mechanical and climatic test methods-Neutron irradiation
半导体器件 机械和气候试验方法
发布日期:
2019-05-15
中子辐照试验用于确定半导体器件对非电离能量损失(NIEL)退化的敏感性。本文所述测试适用于集成电路和分立半导体器件,并用于军事和航空航天相关应用。这是一次破坏性的试验。
测试目标如下:
a) 检测和测量关键半导体器件参数随中子注量的变化,以及b)确定在暴露于规定水平的中子注量后,规定的半导体器件参数是否在规定限值内(见第6条)。
交叉引用:ASTM E 265ASTM E 264ASTM E 263ASTM E 721MIL-STD-883ASTM E 1018ASTM E 722ASTM E 720ASTM E 668ASTM E 2450购买本文件时提供的所有当前修订版均包含在购买本文件中。
The neutron irradiation test is performed to determine the susceptibility of semiconductor devices to non-ionizing energy loss (NIEL) degradation. The test described herein is applicable to integrated circuits and discrete semiconductor devices and is intended for military- and aerospace-related applications. It is a destructive test.
The objectives of the test are as follows:
a) to detect and measure the degradation of critical semiconductor device parameters as a function of neutron fluence, andb) to determine if specified semiconductor device parameters are within specified limits after exposure to a specified level of neutron fluence (see Clause 6).Cross References:ASTM E 265ASTM E 264ASTM E 263ASTM E 721MIL-STD-883ASTM E 1018ASTM E 722ASTM E 720ASTM E 668ASTM E 2450All current amendments available at time of purchase are included with the purchase of this document.