通过使用通常高于10 MHz的超高频超声波，声学显微镜（AM）可以无损地发现和表征物理特征和潜在缺陷（逐层过程中内部特征的可视化），例如材料连续性和不连续性、亚表面缺陷、裂纹、空洞、分层和孔隙。AM观察到的特征和缺陷可能是组件处理、存储、更改或以前使用不当的迹象。如果合同中引用了AS6171/6，则基础文件AS6171一般要求也应适用。

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used.If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.