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Techniques for Suspect/Counterfeit EEE Parts Detection by Thermogravimetric Analysis (TGA) Test Methods 通过热重分析(TGA)试验方法检测可疑/假冒EEE零件的技术
发布日期: 2022-06-28
本试验方法提供了TGA在检测假冒电子元件方面的能力、局限性和可能的应用建议。此外,本文件概述了与TGA应用相关的要求,包括:设备要求、试样要求、方法、控制和校准、数据分析、报告、鉴定和认证。如果合同中引用了AS6171/10,则基础文件AS6171一般要求也应适用。
This test method provides the capabilities, limitations, and suggested possible applications of TGA as it pertains to the detection of counterfeit electronic components. Additionally, this document outlines requirements associated with the application of TGA including: equipment requirements, test sample requirements, methodology, control and calibration, data analysis, reporting, and qualification and certification.If AS6171/10 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
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