该方法标准化了检查、测试程序和最低培训和认证要求，以利用Delid/Decapsulation物理分析检测可疑/假冒（SC）电气、电子和机电（EEE）组件或零件。本文件中描述的方法用于从密封包装上取下盖子，或去除EEE零件的封装或涂层，以检查内部结构，并确定零件是否可疑为伪造品。B.防止在部件分析中包含伪造信息。识别有缺陷的零件C。有助于处理异常零件本试验方法不应与MIL-STD-1580中定义的破坏性物理分析相混淆。MIL-STD-1580描述了用于检查和解释质量问题的破坏性物理分析程序。 由于测试方法的破坏性，允许访问材料、设计和布局信息，该方法还可以观察设备制造商进行的设计和材料或工艺变化趋势。如果合同中引用了AS6171/4，则基础文件AS6171一般要求也应适用。

This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to:a. prevent inclusion of counterfeit parts in the assemblyb. identify defective partsc. aid in disposition of parts that exhibit anomaliesThis test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.Due to the destructive nature of the test method that allows access to materials, design and layout information, the method may also enable observation of trends in design and material or process changes undertaken by the device manufacturer.If AS6171/4 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.