本文件旨在定义使用辐射检查对可疑零件进行检查的方法。对可疑假冒零件进行放射检查的目的是在零件分销商或原始设备制造商（OEM）层面上检测零件的故意误报。辐射检查还可能检测到由于从组件中不当移除零件而导致的零件意外损坏，这可能包括但不限于脱焊操作期间的长期高温暴露或移除期间的机械应力。 电子设备的放射检查包括胶片射线照相和无胶片射线照相，如数字射线照相（DR）、实时射线照相（RTR）和计算机断层扫描（CT）。放射学是微电子器件零件验证的重要工具。对零件进行射线照相分析，以验证内部封装或模具结构与样本一致。如果样本不可用，则应使用该项目可用的技术数据在同质样本群体中进行比较。如果合同中引用了AS6171/5，则基础文件AS6171一般要求也应适用。

The intent of this document is to define the methodology for suspect parts inspection using radiological inspection. The purpose of radiology for suspect counterfeit part inspection is to detect deliberate misrepresentation of a part, either at the part distributor or original equipment manufacturer (OEM) level. Radiological inspection can also potentially detect unintentional damage to the part resulting from improper removal of part from assemblies, which may include, but not limited to, prolonged elevated temperature exposure during desoldering operations or mechanical stresses during removal.Radiological inspection of electronics includes film radiography and filmless radiography such as digital radiography (DR), real time radiography (RTR), and computed tomography (CT). Radiology is an important tool used in part verification of microelectronic devices. Radiographic analysis is performed on parts to verify that the internal package or die construction is consistent with an exemplar. In case an exemplar is not available, comparisons should be made within a homogenous sample population using the technical data available for that item.If AS6171/5 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.