SAE AS6171/2A描述了以下电子元件防伪检测试验方法的要求:方法A:一般EVI、样品选择和处理方法B:详细EVI，包括零件重量测量方法C:重新标记测试方法D:重新表面处理测试方法E:零件尺寸测量方法F:使用SEM进行表面纹理分析本文件的范围主要集中在引线电子元件、微电路、多芯片模块（MCM）和混合电路。其他EEE组件可能需要本程序中未规定的评估。在适用的情况下，本文件可用作指南。需要制定和记录额外的检查或标准，以彻底评估这些额外的零件类型。如果合同中引用了AS6171/2，则基础文件AS6171一般要求也应适用。

SAE AS6171/2A describes the requirements of the following test methods for counterfeit detection of electronic components:Method A: General EVI, Sample Selection, and HandlingMethod B: Detailed EVI, including Part Weight measurementMethod C: Testing for RemarkingMethod D: Testing for ResurfacingMethod E: Part Dimensions measurementMethod F: Surface Texture Analysis using SEMThe scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.